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NLAS4501 Single SPST Analog Switch
The NLAS4501 is an analog switch manufactured in sub-micron silicon-gate CMOS technology. It achieves very low RON while maintaining extremely low power dissipation. The device is a bilateral switch suitable for switching either analog or digital signals, which may vary from zero to full supply voltage. The NLAS4501 is pin-for-pin compatible with the MAX4501. The NLAS4501 can be used as a direct replacement for the MAX4501 in all 2.0 V to 5.5 V applications where a RON performance improvement is required. The Enable pin is compatible with standard CMOS outputs when supply voltage is nominal 5.0 Volts. It is also over-voltage tolerant, making it a very useful logic level translator.
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A2d SC70-5/SC-88A/SOT-353 DF SUFFIX CASE 419A
* Guaranteed RON of 32 W at 5.5 V * Low Power Dissipation: ICC = 2 mA * Provides Voltage translation for many different voltage levels
* * Chip Complexity: FETs 11 * Pb-Free Packages are Available
3.3 to 5.0 V, Enable pin may go as high as +5.5 Volts 1.8 to 3.3 V 1.8 to 2.5 V Improved version of MAX4501 (at any voltage between 2 and 5.5 Volts)
5 1 SOT23-5/TSOP-5/SC59-5 DT SUFFIX CASE 483 d = Date Code
5 A2d 1
COM
1
5
VCC 1 2 3 4
PIN ASSIGNMENT
COM NO GND ENABLE VCC
NO
2
GND
3
4
ENABLE
5
FUNCTION TABLE Figure 1. Pinout (Top View)
On/Off Enable Input L H State of Analog Switch Off On
ORDERING INFORMATION
See detailed ordering and shipping information on page 7 of this data sheet.
Semiconductor Components Industries, LLC, 2004
November, 2004 - Rev. 4
1
Publication Order Number: NLAS4501/D
NLAS4501
MAXIMUM RATINGS
Symbol VCC VIN VIS IIK TSTG TL TJ qJA PD MSL FR VESD Positive DC Supply Voltage Digital Input Voltage (Enable) Analog Output Voltage (VNO or VCOM) DC Current, Into or Out of Any Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature under Bias Thermal Resistance Power Dissipation in Still Air at 85C Moisture Sensitivity Flammability Rating ESD Withstand Voltage Oxygen Index: 30% - 35% Human Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Above VCC and Below GND at 85C (Note 5) SC70-5/SC-88A (Note 1) TSOP-5 SC70-5/SC-88A TSOP-5 Parameter Value *0.5 to )7.0 *0.5 to )7.0 *0.5 to VCC $20 *65 to )150 260 )150 350 230 150 200 Level 1 UL-94-VO (0.125 in) > 2000 > 100 N/A $300 V )0.5 Unit V V V mA C C C C/W mW
ILatch-Up
Latch-Up Performance
mA
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow. 2. Tested to EIA/JESD22-A114-A. 3. Tested to EIA/JESD22-A115-A. 4. Tested to JESD22-C101-A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIN VIO VIS TA tr, tf Positive DC Supply Voltage Digital Input Voltage (Enable) Static or Dynamic Voltage Across an Off Switch Analog Input Voltage (NO, COM) Operating Temperature Range, All Package Types Input Rise or Fall Time, (Enable Input) NORMALIZED FAILURE RATE Vcc = 3.3 V + 0.3 V Vcc = 5.0 V + 0.5 V Characteristics Min 2.0 GND GND GND -55 0 0 Max 5.5 5.5 VCC VCC +125 100 20 Unit V V V V C ns/V
DEVICE JUNCTION TEMPERATURE VERSUS TIME TO 0.1% BOND FAILURES
Junction Temperature 5C 80 90 100 110 120 130 140 Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4 9.4 4.2 2.0 1.0
FAILURE RATE OF PLASTIC = CERAMIC UNTIL INTERMETALLICS OCCUR TJ = 130C TJ = 120C TJ = 100C TJ = 110C TJ = 90C TJ = 80C 100 TIME, YEARS
1 1 10 1000
Figure 2. Failure Rate vs. Time Junction Temperature
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NLAS4501
DC CHARACTERISTICS - Digital Section (Voltages Referenced to GND)
Guaranteed Max Limit Symbol VIH Parameter Minimum High-Level Input Voltage, Enable Inputs Condition VCC 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 VIN = 5.5 V or GND Enable and VIS = VCC or GND 0 V to 5.5 V 5.5 -55 to 255C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +0.1 1.0 <855C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +1.0 1.0 <1255C 1.5 2.1 3.15 3.85 0.5 0.9 1.35 1.65 +1.0 2.0 Unit V
VIL
Maximum Low-Level Input Voltage, Enable Inputs
V
IIN ICC
Maximum Input Leakage Current, Enable Inputs Maximum Quiescent Supply Current (per package)
mA mA
DC ELECTRICAL CHARACTERISTICS - Analog Section
Guaranteed Max Limit Symbol RON Parameter Maximum ON Resistance (Figures 8 - 12) ON Resistance Flatness Condition VIN = VIH VIS = VCC to GND IIsI = <10.0mA VIN = VIH IIsI = <10.0mA VIS = 1V, 2V, 3.5V VIN = VIL VNO = 1.0 V, VCOM = 4.5 V or VCOM = 1.0 V and VNO 4.5 V VIN = VIL VNO = 4.5 V or 1.0 V VCOM = 1.0 V or 4.5 V VCC 3.0 4.5 5.5 4.5 -55 to 255C 45 30 25 4 <855C 50 35 30 4 <1255C 55 40 35 5 Unit W
RFLAT(ON)
W
INO(OFF)
Off Leakage Current, Pin 2 (Figure 3)
5.5
1
10
100
nA
ICOM(OFF)
Off Leakage Current, Pin 1 (Figure 3)
5.5
1
10
100
nA
AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 ns)
Guaranteed Max Limit VCC Symbol tON Parameter Turn-On Time Test Conditions RL = 300 W, CL = 35 pF (Figures 4, 5, and 13) (V) 2.0 3.0 4.5 5.5 2.0 3.0 4.5 5.5 -55 to 255C Min Typ 7.0 5.0 4.5 4.5 11.0 7.0 5.0 5.0 Max 14 10 9 9 22 14 10 10 Min <855C Typ Max 16 12 11 11 24 16 12 12 Min <1255C Typ Max 16 12 11 11 24 16 12 12 Unit ns
tOFF
Turn-Off Time
RL = 300 W, CL = 35 pF (Figures 4, 5, and 13)
ns
Typical @ 25, VCC = 5.0 V CIN CNO or CNC CCOM(OFF) CCOM(ON) Maximum Input Capacitance, Select Input Analog I/O (switch off) Common I/O (switch off) Feedthrough (switch on) 8 10 10 20 pF
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NLAS4501
ADDITIONAL APPLICATION CHARACTERISTICS (Voltages Referenced to GND Unless Noted)
VCC Symbol BW Parameter Maximum On-Channel -3dB Bandwidth or On Channel 3dB Minimum Frequency Response Maximum Feedthrough On Loss Condition VIS = 0 dBm VIS centered between VCC and GND (Figures 6 and 14) (Fi d VIS = 0 dBm @ 10 kHz VIS centered between VCC and GND (Figure 6) (Fi f = 100 kHz; VIS = 1 V RMS VIS centered between VCC and GND (Figures 6 and 15) (Fi d VIS = VCC to GND, FIS = 20 kHz tr = tf = 3 ns RIS = 0 W, CL = 1000 pF Q = CL * DVOUT (Figures 7 and 16) FIS = 20 Hz to 1 MHz, RL = Rgen = 600 W, CL = 50 pF VIS = 3.0 VPP sine wave VIS = 5.0 VPP sine wave (Figure 17) V 3.0 4.5 5.5 3.0 4.5 5.5 3.0 4.5 5.5 3.0 5.5 Limit 25C 190 200 220 -2 2 -2 -2 2 -93 93 Unit MHz
VONL
dB
VISO
Off Channel Off-Channel Isolation
dB
Q
Charge Injection Enable Input to Common I/O
1.5 3.0
pC
THD
Total Harmonic Distortion THD + Noise
3.3 5.5
0.3 0.15
%
1.00E+05 1.00E+04 1.00E+03 1.00E+02
LEAKAGE (pA)
1.00E+01 1.00E+00 1.00E-01 1.00E-02 1.00E-03 1.00E-04 1.00E-05 1.00E-06 1.00E-07
ICOM(ON)
ICOM(OFF) INO(OFF) 5 25 45 65 85 105 125 145
-55 -35 -15
TEMPERATURE (C)
Figure 3. Switch Leakage vs. Temperature
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NLAS4501
DUT COM VOUT 300 W 35 pF Output VOL VCC Input 0V VOH 50% 50%
VCC 0.1 mF
NO
90%
90%
Input
Figure 4. tON/tOFF
VCC DUT NO COM 300 W VOUT 35 pF Output VOL Input Input 0V VOH VCC 50%
tON
tOFF
50%
10% tOFF tON
10%
Figure 5. tON/tOFF
Reference COM
DUT Transmitted NO
50 W Generator 50 W
Channel switch control/s test socket is normalized. Off isolation is measured across an off channel. On loss is the bandwidth of an On switch. VISO, Bandwidth and VONL are independent of the input signal direction. VISO = Off Channel Isolation = 20 Log VOUT for VIN at 100 kHz VIN VONL = On Channel Loss = 20 Log VOUT for VIN at 100 kHz to 50 MHz VIN Bandwidth (BW) = the frequency 3 dB below VONL
Figure 6. Off Channel Isolation/On Channel Loss (BW)/Crosstalk (On Channel to Off Channel)/VONL
DUT NO COM CL Output VIN
VCC GND
Off VIN
On
Off
DVOUT
Figure 7. Charge Injection: (Q)
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NLAS4501
80 70 60 RON (W) 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 VCOM (VOLTS) VCC = 2.5 VCC = 3.0 VCC = 4.5 VCC = 2.0 RON (W) 80 70 60 50 40 30 20 10 0 0 0.2 125C 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 -55C 25C 85C
VIS (VOLTS)
Figure 8. RON vs. VCOM and VCC (@255C)
Figure 9. RON vs. VCOM and Temperature, VCC = 2.0 V
30 25 20 -55C
45 40 35 30 RON (W) 25 20 15 10 5 0 0 125C 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4 85C -55C 25C RON (W)
15 10 5 0 125C 25C 85C
0
0.3
0.6
0.9
1.2 1.5
1.8
2.1
2.4
2.7
3
VCOM (VOLTS)
VCOM (VOLTS)
Figure 10. RON vs. VCOM and Temperature, VCC = 2.5 V
Figure 11. RON vs. VCOM and Temperature, VCC = 3.0 V
35.0 18 16 14 RON (W) 12 10 8 6 4 2 0 0 0.4 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 VCOM (VOLTS) 125C TIME (nS) 85C 25C -55C 30.0 25.0 20.0 15.0 10.0 5.0 0.0 2.0 tOFF 3.0 4.5 VCC (V) 5.0 5.5 tON
Figure 12. RON vs. VCOM and Temperature, VCC = 4.5 V
Figure 13. Switching Time vs. Supply Voltage, T = 255C
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NLAS4501
0 10 Bandwidth (On - Loss) OFF ISOLATION (dB/Div) 0
BANDWIDTH (dB/Div)
Phase (Degrees)
5
PHASE (Degrees)
0
-50
VCC = 5.0 V TA = 25C
VCC = 5.0 V TA = 25C
0.01
0.1
1
10
100 300
-100
0.01
0.1
1 FREQUENCY (MHz)
10
100 300
FREQUENCY (MHz)
Figure 14. ON Channel Bandwidth and Phase Shift Over Frequency
Figure 15. Off Channel Isolation
1.60 1.40 1.20 1.00 Q (pC) 0.80 0.60 0.40 0.20 0.00 0.0 VCC = 3.0 V VCC = 5.0 V
100
10 THD (%)
1
3.3 V
0.1 5.5 V 0.01 1.0 2.0 3.0 3.6 VCOM (V) 4.0 4.5 5.0 10 100 1000 10000 100000 1000000 FREQUENCY (Hz)
Figure 16. Charge Injection vs. VCOM
Figure 17. THD vs. Frequency
DEVICE ORDERING INFORMATION
Device Nomenclature Device Order Number NLAS4501DFT2 NLAS4501DFT2G NLAS4501DTT1 NLAS4501DTT1G Circuit Indicator NL NL NL NL Device Function 4501 4501 4501 4501 Package Suffix DF DF DT DT Tape & Reel Suffix T2 T2 T1 T1
Technology AS AS AS AS
Package Type SC-88A SC-88A (Pb-Free) SOT-23/TSOP-5 SOT-23/TSOP-5 (Pb-Free)
Shipping 178 mm (7 ) 3000 / Tape & Reel 178 mm (7 ) 3000 / Tape & Reel 178 mm (7 inch) 3000 / Tape & Reel 178 mm (7 inch) 3000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
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NLAS4501
PACKAGE DIMENSIONS
SC70-5/SC-88A/SOT-353 DF SUFFIX CASE 419A-02 ISSUE G
A G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. 419A-01 OBSOLETE. NEW STANDARD 419A-02. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. INCHES MIN MAX 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 BSC --- 0.004 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 MILLIMETERS MIN MAX 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 BSC --- 0.10 0.10 0.25 0.10 0.30 0.20 REF 2.00 2.20
5
4
S
1 2 3
-B-
D 5 PL
0.2 (0.008)
M
B
M
N J C
DIM A B C D G H J K N S
H
K
SOLDERING FOOTPRINT*
0.50 0.0197
0.65 0.025 0.65 0.025
0.40 0.0157 1.9 0.0748
SCALE 20:1
mm inches
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NLAS4501
PACKAGE DIMENSIONS
SOT23-5/TSOP-5/SC59-5 DT SUFFIX CASE 483-02 ISSUE C
D
5 1 2 4 3
S
B
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. A AND B DIMENSIONS DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 2.90 3.10 0.1142 0.1220 B 1.30 1.70 0.0512 0.0669 C 0.90 1.10 0.0354 0.0433 D 0.25 0.50 0.0098 0.0197 G 0.85 1.05 0.0335 0.0413 H 0.013 0.100 0.0005 0.0040 J 0.10 0.26 0.0040 0.0102 K 0.20 0.60 0.0079 0.0236 L 1.25 1.55 0.0493 0.0610 M 0_ 10 _ 0_ 10 _ S 2.50 3.00 0.0985 0.1181
L A
G J
C 0.05 (0.002) H K
M
SOLDERING FOOTPRINT*
0.95 0.037 1.9 0.074
2.4 0.094 1.0 0.039 0.7 0.028
mm inches
SCALE 10:1
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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NLAS4501
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PUBLICATION ORDERING INFORMATION
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NLAS4501/D

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